JPH0436120Y2 - - Google Patents
Info
- Publication number
- JPH0436120Y2 JPH0436120Y2 JP13941085U JP13941085U JPH0436120Y2 JP H0436120 Y2 JPH0436120 Y2 JP H0436120Y2 JP 13941085 U JP13941085 U JP 13941085U JP 13941085 U JP13941085 U JP 13941085U JP H0436120 Y2 JPH0436120 Y2 JP H0436120Y2
- Authority
- JP
- Japan
- Prior art keywords
- leads
- integrated circuit
- container
- metal plate
- board
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 239000002184 metal Substances 0.000 claims description 10
- 239000000758 substrate Substances 0.000 claims description 5
- 239000000843 powder Substances 0.000 description 4
- 239000011521 glass Substances 0.000 description 3
- 230000008018 melting Effects 0.000 description 3
- 238000002844 melting Methods 0.000 description 3
- 238000007747 plating Methods 0.000 description 3
- 238000007789 sealing Methods 0.000 description 3
- 230000000694 effects Effects 0.000 description 2
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 1
- 239000000156 glass melt Substances 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000007650 screen-printing Methods 0.000 description 1
- 239000005394 sealing glass Substances 0.000 description 1
Landscapes
- Lead Frames For Integrated Circuits (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP13941085U JPH0436120Y2 (en]) | 1985-09-13 | 1985-09-13 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP13941085U JPH0436120Y2 (en]) | 1985-09-13 | 1985-09-13 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS6249246U JPS6249246U (en]) | 1987-03-26 |
JPH0436120Y2 true JPH0436120Y2 (en]) | 1992-08-26 |
Family
ID=31045287
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP13941085U Expired JPH0436120Y2 (en]) | 1985-09-13 | 1985-09-13 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH0436120Y2 (en]) |
-
1985
- 1985-09-13 JP JP13941085U patent/JPH0436120Y2/ja not_active Expired
Also Published As
Publication number | Publication date |
---|---|
JPS6249246U (en]) | 1987-03-26 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
JPH04233257A (ja) | 大規模集積電子部品 | |
JPS5832785B2 (ja) | 電子部品容器 | |
US3868725A (en) | Integrated circuit lead structure | |
JPH0436120Y2 (en]) | ||
JP3000083B2 (ja) | 電子部品容器の製造方法 | |
JPS60201696A (ja) | フラツトパツケ−ジの半田付方法 | |
JP3606672B2 (ja) | チップ型過電流保護素子 | |
JPH083018Y2 (ja) | 半導体パッケージ用連結型リードフレーム | |
JPH0427172Y2 (en]) | ||
JPS637601A (ja) | 面実装用ネツトワ−ク抵抗器 | |
JPH06801Y2 (ja) | チツプ型正特性サ−ミスタ | |
JP2725719B2 (ja) | 電子部品及びその製造方法 | |
JPS5844561Y2 (ja) | シングルインライン型電子部品 | |
JPH0356032Y2 (en]) | ||
JPH06196516A (ja) | 半田塗布方法、半導体装置の製造方法およびスキージ | |
JPS6011651Y2 (ja) | 半導体装置 | |
JP4290833B2 (ja) | 半導体素子収納用パッケージ | |
JPH0621276U (ja) | セラミックコンデンサの実装 | |
JPH0543477Y2 (en]) | ||
JPS6196793A (ja) | チツプ電子部品実装回路装置 | |
JP2844259B2 (ja) | 平型電子部品の製造方法 | |
JPH03149893A (ja) | 半導体装置 | |
JPS63102306A (ja) | セラミツクコンデンサ | |
JPH0536842U (ja) | 電子部品収納用パツケージ | |
JPH0732561U (ja) | 湿度センサ |